Yosi Shacham, D.Sc. | Communications 2025

Yosi Shacham

The Bernard L. Schwartz Chair for Information Nano Technologies and Professor

School of Electrical Engineering, Tel Aviv University

Speech Title:

“More than Moore – Micro & Nano Engineering for Communication"

Abstract:

There are many indications pointing towards a possible paradigm shift in solid-state electronics for information and communication technologies in the next 10 years. Downscaling of the CMOS process, which is currently at the 22 nm node, seems to face serious challenge due to physical limitations of the devices and interconnects, their patterning technologies and cost of manufacturing. Comparing companies revenue growth and the staggering R&D costs show that by the year of 2020 the cost of developing new high end products will cause return-on-investment (ROI) issues to many products. Process issues like the transition to extreme UV lithography (EUV) 13 nm exposure also is extremely expensive with many manufacturing issues unsolved. From the device point of views, the 3D transistor technology, known also as Fin-FET yields surprisingly good results at the 22 nm node; however, it will face serious device issues when it will be reduced to the sub-15 nm regime. In this talk we will review the key silicon very large scale integration (VLSI) issues and their effect on upcoming information and communication technologies. We will review new silicon based technologies, such as 3D-integration and high-speed analog designs, together with “non-silicon” technologies, such as biochips, micro electro machining and printed electronics. All those technologies will require intensive research and development in both hardware and software, such as related signal processing and algorithms. It will also require new solutions to the integration s with environmental friendly energy sources for portable systems. All of the above will require intensive review of the engineering teaching curriculum. It will require better basic knowledge in quantum electronics and system engineering. Future technologies will offer very high device density, at low power, with enormous memory (both volatile and non-volatile) with high error bit rate and a great need for efficient error correction codes and compression algorithms. Many new technologies will require additional classes such as material science, mechatronics, sensor technologies, robotics, and human-machine interface. Another key factor is the increasing synergy with other disciplines both in engineering and in other faculties such as exact sciences, life science and medicine.

Bio:

Yosi Shacham published 185 journal papers, >300 conference papers in registered proceedings, 4 chapters in books, edited two conference proceedings books, edited two books, and is the member of the advisory committee of the advanced metallization conference (AMC), the Materials for Microelectronic (MAM) conference and electrochemical micro and nano technologies (EMNT). He is also Member of the editorial board of the Journal of Micro Electronics Engineering and Editor of special issues in the Journal of Micro Electronics Engineering and Electrochimica Acta.

His research activity is in the field of micro and nano fabrication and metallization science and technology. For more than 20 years he investigates electroless plating micro and nano fabrication for various applications such as for microelectronics, micromachining, and biochips. For the last 10 years he has a significant research program on whole cell biochips and solid-state biosensors.

Between 1999 to 2001 he was the academic director of the Micro-technologies labs at Tel-Aviv University and in 2001-2004 the director of the Tel-Aviv University research institute for nano science and nano-technologies. He was the chairman of the department of electrical engineering – physical electronics and is cuurently the vice dean of engineering. He is also a member of the board of directors of Ramot-at Tel Aviv University Ltd and was a member of the university board of governors. He is a member of MAGNET committee, supporting generic technologies in the industry and the academia , at the ministry of trade, industry and employment.

D.Sc. EE 1983, M.Sc. EE 1978, and B.Sc. EE (Summa-cum Laude) 1974, all in Technion, Israel. 1983-1986 post-doctoral research at U.C. Berkeley. 1987- 1989 senior lecturer, the Technion, Israel. 1989-1996 assistant professor Cornell university, 1997-2001 Associate professor and since 2001 a full professor at the school of electrical engineering, Physical Electronics department, Tel-Aviv University. He is also a visiting professor at the school of applied chemistry, Waseda University, Tokyo, Japan where he spent his Sabbatical year at 2004-2005.